© FengRun Electronics Co.,Ltd
Name: FPGA PCB assembly patch manufacturer
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
BGA industrial control motherboard assembly
Name: BGA industrial control motherboard assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Name: Communication module BGA assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 20 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Consumer Electronics BGA assembly
Name: Consumer Electronics BGA assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 20 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Industrial control board BGA assembly
Name: Industrial control board BGA assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 20 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Huawei 4G communication module BGA assembly
Name: Huawei 4G communication module BGA assemblyed
Number of SMT lines: 5 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Amlogic Solution Multimedia Motherboard BGA assembly
Name: Amlogic Solution Multimedia Motherboard BGA assembly
Number of SMT lines: 5 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Name: Medical motherboard BGA assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc.
Industrial control SMT chip processing
Name: Industrial control SMT chip processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
Control motherboard SMT assembly
Name: Control motherboard SMT assembly
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
Bluetooth module smt patch processing
Name: Bluetooth module smt patch processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
Medical motherboard SMT chip processing
Name: Medical motherboard SMT chip processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
4G communication module PCBA processing
Name: 4G communication module PCBA processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
Industrial control board SMT processing
Name: Industrial control board SMT processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
Notebook game graphics card SMT processing
Name: Notebook game graphics card SMT processing
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
4G communication module SMT patch
Name: 4G communication module SMT patch
Number of SMT lines: 7high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone
PCB Assembly 10W 56mm Aluminum Plate
Name: PCB Assembly 10W 56mm Aluminum Plate
Substrate: FR-4, CEM-3, Aluminum
Layers: 1-22 layers
Maximum panel: 1550mm*800mm
Copper Thickness: 0.5oz, 1oz, 2oz, 3oz, 4oz
Dielectric thickness: 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm
Core thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm
Plate thickness: 0.4mm – 4.0mm
Thickness tolerance: +/-10%
Aluminum machining: provide drilling, tapping, milling, routing, punching, folding
Sensitive hole: 0.2 mm
AC220V LED Panel PCB Assembly
Name: AC220V LED Panel PCB Assembly
Substrate: FR-4, CEM-3, Aluminum
Layers: 1-22 layers
Maximum panel: 1550mm*800mm
Copper Thickness: 0.5oz, 1oz, 2oz, 3oz, 4oz
Dielectric thickness: 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm
Core thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm
Plate thickness: 0.4mm – 4.0mm
Thickness tolerance: +/-10%
Aluminum machining: provide drilling, tapping, milling, routing, punching, folding
Sensitive hole: 0.2 mm
PCB Assembly SMD 2835 Round Board
Name: PCB Assembly SMD 2835 Round Board
Number of layers: 1 layer
PCB thickness: 1.0-2.0mm
Copper Thickness: 1oz-2oz
Surface: HAL/OSP/LF-HAL
Thermal conductivity: 1.0-3 0w/mk
Solder Mask Type: Liquid Photosensitive Solder Marker
Accepting OEM orders for SMT and A/I assembly projects
SMD 2835 LED Light Module PCB Assembly
Name: SMD 2835 LED Light Module PCB Assembly
Number of layers: 1 layer
PCB thickness: 1.0-2.0mm
Copper Thickness: 1oz-2oz
Surface: HAL/OSP/LF-HAL
Thermal conductivity: 1.0-3 0w/mk
Solder Mask Type: Liquid Photosensitive Solder Marker
Accepting OEM orders for SMT and A/I assembly projects
Prototype PCB Assembly SMD Street Light LED
Name: Prototype PCB Assembly SMD Street Light LED
Material: CEM1, CEM3
Layers: 1~24 layers
Maximum / panel size: 541*647mm (special can be made 950mm)
Aspect Ratio: Minimum 1:8
Ring: Min. 0.1mm
Finished hole size: PTH ±0.003”, NPTH ±0.002″
Impedance control: ±5%
Solder Mask Registration: ±0.003″
Layer-to-layer registration: ±0.003″
PCB Project: PCB OEM/PCB Design/PCB Assembly
Single Sided Aluminum Prototype PCB Assembly
Name: Single Sided Aluminum Prototype PCB Assembly
Layers: 1-20
Plate thickness: 0.20mm-4.0mm
Copper Thickness: 17.5um-175um (0.5oz-5oz)
Solder mask color: red, black, blue, green, yellow
Stencil cleaning frequency: 1 time/5 to 10 sheets
Surface treatment: spray tin, lead-free spray tin, OSP, gold plating, immersion gold
Minimum trace width: 0.15mm
minute. Line spacing: 3 mil (0.075 mm)
Minimum space width: 0.15mm
Substrate: FR4/Aluminum
Automotive Lighting LED PCB Assembly
Name: SMD LED chip PCB assembly
Material: Aluminum base
Voltage: 160-280V
Wattage: 3W
Chip: SMD-2835/5730/4014
Number of LEDs: 12
Diameter: 31mm
Temperature: 2700-6500k
T8/T5/LED slats/line lights SMT processing
Name: T8/T5/LED slat/line light SMT processing
Substrate Material: Aluminum
Copper thickness: 1.0-2.0mm
Copper Thickness: 0.5-6oz
Thermal conductivity: 1.0-3.0W/mk
Breakdown voltage: 2-4KV
Lead: SMD 2835
Flammability: 94V0
Solder mask: white
Silkscreen: black
Working temperature: -25-75℃
Rigid-Flex PCB Assembly manufacturers
Name: Flexible circuit board assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
FPC PCB Assembly
Name: FPC PCB Assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Camera Module Rigid-Flex PCB Assembly
Name: FPC OV2640 Camera Module PCB Assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Medical Device Rigid-Flex PCB Assembly
Name: Medical Device Rigid-Flex PCB Assembly
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
4-layer flexible PCBs
Name: 4-layer flexible PCBs
BGA mounting range: 0.18mm-0.4mm
Minimum placement material package: 01005
Minimum line width/spacing: 3mil/3mil
BGA pitch: 0.25mm
Minimum diameter of finished product: 0.1mm
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm
Production equipment: 1 MYDATA solder paste jet printer, 1 solder paste detector, 2 MYDATA placement machines, 3 YAMAHA placement machines, 3 reflow soldering machines, and 1 wave soldering machine
Medical Machinery PCBA Processing
Name: Medical Machinery PCBA Processing
Substrate: FR4, FR1, CEM3, Aluminum, TG150, TG170, 94V0
Copper Thickness: 1-4oz
Plate thickness: 0.5-3.2mm
Minimum aperture: 0.15mm
Minimum line width: 0.08mm
Minimum line spacing: 0.08mm
Surface treatment: spray tin, lead-free spray tin, OSP, ENIG, gold
Layers: 1-20 layers
Maximum panel size: 541*647mm
Finished hole size: PTH +/-0.003”, NPTH +/-0.002
Wireless Charging Module Rigid-Flex PCB Assembly
Name: Wireless Charging Module Rigid-Flex PCB Assembly
Substrate: FR4, FR1, CEM3, Aluminum, TG150, TG170, 94V0
Copper Thickness: 1-4oz
Plate thickness: 0.5-3.2mm
Minimum aperture: 0.15mm
Minimum line width: 0.08mm
Minimum line spacing: 0.08mm
Surface treatment: spray tin, lead-free spray tin, OSP, ENIG, gold
Layers: 1-20 layers
Maximum panel size: 541*647mm
Finished hole size: PTH +/-0.003”, NPTH +/-0.002
6-layer rigid-flex PCB assembly
Name: 6-layer rigid-flex PCB assembly
Structure: 2L flexible + 4L rigid
Hole size: 8mil
Surface Treatment: Immersion Gold
Material: FR-4+PI
Number of layers (R+F): 2R+2F+2R layers
Thickness: 0.24mm+1.2mm
Minimum hole: 0.15 mm
Minimum Line/Space: 4/4mil
Impedance: No
Surface Treatment: Gold Plated
Multilayer Rigid-Flex PCB Assembly
Name:Multilayer Rigid-Flex PCB Assembly
Category:FPC
Description:Basic parameters: Material structure: double-sided adhesive + low loss yellow cover film + (Line copper + plastic + high frequency dielectric polyimide substrate + glue + line copper + Low loss yellow cover film
Tolerance: free bending, folding
Tolerance: ± 0.03mm
Thickness: 0.15mm
Stiffener: positive and negative 0.15mm steel stiffener
Production process: solder coating, plug plating, cover, film type, solder mask type shielded scratch
Surface treatment: Chen Jin (gold) 1 to 2 micro inches
Orthopedic surgical instrument smt patch
Name: Orthopedic surgical instrument smt patch
Substrate: FR4, FR1, CEM3, Aluminum, TG150, TG170, 94V0
Copper Thickness: 1-4oz
Plate thickness: 0.5-3.2mm
Minimum aperture: 0.15mm
Minimum line width: 0.08mm
Minimum line spacing: 0.08mm
Surface treatment: spray tin, lead-free spray tin, OSP, ENIG, gold
Layers: 1-20 layers
Maximum panel size: 541*647mm
Finished hole size: PTH +/-0.003”, NPTH +/-0.002
Security Equipment Turnkey PCB Assembly
Name: Security Equipment Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Communication motherboard Turnkey PCB Assembly
Name: Communication motherboard Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
In-vehicle communication system PCB Assembly
Name: In-vehicle communication system Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Infrared Spectrometer Turnkey PCB Assembly
Name: Infrared Spectrometer Turnkey PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
CNC system Turnkey PCB Assembly
Name: CNC system Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Projector Turnkey PCB Assembly
Name: Projector Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Industrial Control Turnkey PCB Assembly
Name: Industrial Control Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Medical Equipment Turnkey PCB Assembly
Name: Medical Equipment Turnkey PCB Assembly
Material: Fiberglass Epoxy
Mechanical rigidity: rigid
Substrate: Copper
Model: FR-4
Material Type: Fr4 Tg130/140, Fr4 High Tg170
Specifications: Rohs, UL, ISO9001
HS Code: 853409000
Dielectric: FR-4
Flame retardant properties: HB
Processing technology: electrolytic foil
Smart home appliance PCBA
Name: Smart home appliance PCBA
Substrate: FR4
Copper Thickness: 1 oz
Plate thickness: 1.6mm
Minimum hole size: 0.2mm
Minimum line width: 3ml
Minimum line spacing: 3ml
Finish: 3ml
Board size: customized
Product Name: PCB/PCBA Component Prototype
Material: FR4/Aluminum/Ceramic CEM1
Ventilator PCB Assembly
Name: Ventilator PCB Assembly
Substrate: FR4
Copper Thickness: 1 oz
Plate thickness: 1.6mm
Minimum hole size: 0.2mm
Minimum line width: 3ml
Minimum line spacing: 3ml
Finish: 3ml
Board size: customized
Product Name: PCB/PCBA Component Prototype
Material: FR4/Aluminum/Ceramic CEM1
Industrial Automation Prototype PCB Assembly
Name: Industrial Automation Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Instrumentation Prototype PCB Assembly
Name: Instrumentation Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Netcom Prototype PCB Assembly
Name: Netcom Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Aviation Components Control Board
Name: Aviation Components Control Board
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Communication equipment PCB assembly
Name:Security Equipment Motherboard Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
AV motherboard Prototype PCB Assembly
Name:AV motherboard Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Motor Control Board Prototype PCB Assembly
Name: Motor Control Board Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Industrial Control Power Prototype PCB Assembly
Name: Industrial Control Power Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Digital Electronics Prototype PCB Assembly
Name: Digital Electronics Prototype PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Driver Through Hole PCB Assembly
Name: Driver Through Hole PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
PCB Assembly of Car Remote Control System
Name: PCB Assembly of Car Remote Control System
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Smart Electronic Through Hole PCB Assembly
Name: Smart Electronic Through Hole PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Industrial Control Through Hole PCB Assembly
Name: Industrial Control Through Hole PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Medical Device Through Hole PCB Assembly
Name: Medical Device Through Hole PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Electronic Device Through Hole PCB Assembly
Name: Electronic Device Through Hole PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
DIP Through Hole PCB Assembly
Name: DIP Through Hole Pcb Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Communication Through Hole PCB Assembly
Name: Communication Through Hole PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Through Hole PCB Assembly
Name: Through Hole PCB Assembly Telecom Equipment PCB
Substrate: FR4
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Smart Consumer Electronics Low Volume PCB Assembly
Name: Small batch wireless speaker PCB assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Small batch car charger PCB assembly
Name: Small batch car charger PCB assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Automotive Electronics PCB Assembly
Name: Automotive Electronics PCB Assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Small batch PCB assembly patch
Name: Small batch PCB assembly patch
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Equipment Development PCB Assembly
Name: Equipment Development PCB Assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Small batch PCBA assembly supplier
Name: Small batch PCBA supplier
Substrate: FR-4/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Device Development Board SMT Assembly
Name: Device Development Board SMT Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
LED Printed circuit board Assembly
Name: LED PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Control Board Low Volume PCB Assembly
Name: Control Board Low Volume PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Professional car dvr PCB assembly
Name: Professional car dvr PCB assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Communication equipment printed circuit board assembly
Name: Communication equipment PCB assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
CNC Stepper Controller PCBA board
Name: CNC Stepper Controller PCBA board
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Laser marking machine PCB assembly
Name: Laser marking machine PCB assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Wireless Charger PCB Assembly
Name: Wireless Charger PCB Assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Vending Machine PCB Assembly
Name: Vending Machine Motherboard PCB Assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Bulk Security Equipment PCB Assembly
Name: Bulk Security Equipment PCB Assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Mass industrial control motherboard assembly
Name: Mass industrial control motherboard assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Mass touch screen motherboard assembly
Name: Mass touch screen motherboard assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Bulk GPS circuit board assembly
Name: Bulk GPS circuit board assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
RFPD 5G Smallcell Hybrid PCB Assembly
Functionality: quad transmitters, quad receivers,
and dual observation receivers with 2 inputs each
Bandwidth: 200 MHz receiver,
200 MHz large signal/ 450 MHz synthesis transmitter
,and 450 MHz observation receiver
Tuning range: 650 MHz to 6 GHz
Interface: 12 Gbps JESD204B/C 1
Power consumption: 5 W 2
Multichip LO phase synchronization
DFE features: Enhanced DPD / CLGC / CFR 3
Package: 14 ×14 BGA
XWR6843 mmWave sensing device PCB Assembly
Name: FR4-based PCB substrate Assembly
Wide field of view antenna: Azimuth FOV 120°, Elevation FOV 80°
Discrete DCDC power management solution
Relaxed PCB rules: Lower manufacturing cost
– No micro vias, only through via
– No vias on the BGA pads
Serial port for onboard QSPI flash programming
60-pin, high-density (HD) connectors for raw analog-to-digital converter (ADC) data over LVDS：Onboard CAN-FD transceiver；USB powered standalone mode of operation
Huawei RRU3908 base station PCB Assembly
Name: Huawei RRU3908 base station PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station
Placement speed: chip component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
mmWave Hybrid PCB Assembly
Name:mmWave Hybrid PCB assembly
Plate：FR4-based PCB substrate
Wide field of view antenna: Azimuth FOV 120°, Elevation FOV 80°
Discrete DCDC power management solution
Relaxed PCB rules: Lower manufacturing cost
– No micro vias, only through via
– No vias on the BGA pads
Application：60-GHz to 64-GHz mmWave sensor
• Serial port for onboard QSPI flash programming
• 60-pin, high-density (HD) connectors for raw analog-to-digital converter (ADC) data over LVDS
• Onboard CAN-FD transceiver
WARP Radio Hybrid PCB Assembly
Name: WARP Radio Hybrid PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station
Placement speed: chip component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Quick Turn PCB PCBA for Medical equipment
Name：Medical equipment PCB assembly
Condition：New
PCBA-Testing：X-ray, Aoi
Small Order：Acceptable
Type：Rigid Circuit Board
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Transport Package：Antistatic Package+Plastic Box and Carton Box
Trademark：Customized
Single-sided vehicle power supply PCB assembly
High-Power Converter Adjustable Power Supply PCBA for Car Power Charger
PCBA-Testing：X-ray, Aoi
Small Order：Acceptable
Type：Rigid Circuit Board
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Transport Package：Antistatic Package+Plastic Box and Carton Box
Trademark：Customized
Robotics Circuit Board Controler PCBA
Medical PCBA PCB Shenzhen Medical Equipment Power Supply PCBA Manufacturer PCB Board
Condition：New
PCBA-Testing：X-ray, Aoi
Small Order：Acceptable
Type：Rigid Circuit Board
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Transport Package：Packed in Carton
Specification：Copper
Single-sided PCB Assembly Services
Name:Single-sided PCB Assembly Services
PCB Layers：1-48L
PCB Type：Rigid PCBs, Flexible PCBs, Rigid-flex PCBs
Max Board Size：700×460 Mm
Function Test：100% Functional Test
PCBA Testing：X-ray,AOI Test,Functional Test
High Light：Multilayer Pcb Assembly, Automated Through Hole Pcb Assembly, Through Hole Circuit Card Ass
High Quality Double-Sided Fr4 PCB OEM Assembly Service
Name: IoT Double-Sided PCB Assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station
Placement speed: chip component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
Double sided SMD boards assembled
Name：Electronics Medical PCBA and PCB Assembly
Condition：New
Certificate：ISO9001/ISO13485/IATF16949
Solder Mask：Green
Min. Hole Size：0.20 mm
Min. Line Width：0.1mm
Copper Thickness：0.5 Oz ~ 7.0 Oz
Min. Line Spacing：0.075mm
Board Thickness：0.35mm ~ 7.0mm
Surface Finishing：HASL Lead Free
Transport Package：Anti-Static Bag + Bubble Packing +Carton
RoHS Custom Quick Turn PCB Manufacturing and PCB Assembly
Name: RoHS Custom Quick Turn PCB Assembly(SMT chip processing)
PCBType: Rigid Circuit Board
Dielectric: FR-4Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Quality Grade: Ipc Class 2, Ipc Class 3
Brand Of Laminate: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers
OSP Finish 94v0 PCB Board RoHS Medical PCB Assembly
Name：OSP Finish 94v0 PCB Board RoHS Medical PCB Assembly
PCBA-Testing：X-ray, Aoi
Small Order：Acceptable
Type：Rigid Circuit Board
Flame Retardant：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Transport Package：Antistatic Package+Plastic Box and Carton Box
Production Capacity：100K/Month
OEM Electronic Medical Equipment PCB Customized
Name:OEM Electronic Medical Equipment PCB Customized
PCBA-Testing：X-ray, Aoi
Small Order：Acceptable
Type：Rigid Circuit Board
Flame Retardant：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Transport Package：Antistatic Package+Plastic Box and Carton Box
Trademark：Customized
Medical Audio Motherboard Assembly Circuit PCB Board Multilayer PCB Assembly
Name:Medical Audio Motherboard Assembly Circuit PCB Board Multilayer PCB Assembly
Product Type：PCB Assembly
Min.Hole Size：0.12mm
Solder Mask Colour：Green, Blue, White, Black, Yellow, Red etc
Surface Finish：HASL, Enig, OSP, Gold Finger
Min Trace Width/Space：0.075/0.075mm
Copper Thickness：1 – 12 Oz
Assembly Modes：SMT, DIP, Through Hole
Application Field：LED, Medical, Industrial, Control Board
Samples Run：Available
Transport Package：Vacuum Packing/Blister/Plastic /Cartoon
Air conditioner controller DIP processing
Name: Air conditioner controller DIP processing
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station
Placement speed: chip component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, Flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone
dip plug-in processing manufacturers
Name: dip plug-in processing manufacturers
PCB Type: Rigid Circuit Board
Dielectric: FR-4Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Quality Grade: Ipc Class 2, Ipc Class 3
Brand Of Laminate: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers
Module patch plug-in processing
Name: Module patch plug-in processing
PCB Type: Rigid Circuit Board
Dielectric: FR-4Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Quality Grade: Ipc Class 2, Ipc Class 3
Brand Of Laminate: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers
Medical PCB Board Blood Pressure Monitor PCBA Assembly Supplier
PCB Assembly Name：Medical PCB Board Blood Pressure Monitor PCBA Assembly Supplier
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
MOQ：1 PCS
Layer：1-18 Layer
Copper Thickness：0.5oz-6oz
Board Thickness：0.2mm-4mm
Min.Hole Size：0.1mm (4 Mil)
Min.Line Spacing：0.1mm (4 Mil)
PCBA QC：X-ray, Aoi Test, Function Test(100% Test)
Specialised：Consumer, LED, Medical, Industrial, Control Board
Delivery：PCB, 7-10 Days;PCBA, 2-3weeks
Precision Medical Equipment Circuit Board PCBA RoHS PCB Board Assembly
Name：Precision Medical Equipment Circuit Board PCBA RoHS PCB Board Assembly
Metal Coating：Silver,Copper,Gold,Tin
Mode of Production：SMT
Layers：Multilayer
Base Material：Fr4 Tg130,150,Tg170 /Aluminum
Certification：RoHS, ISO
Customized：Customized
Condition：New
Solder Mask Color：Black.Red.Yellow.White.Blue.Green
Testing Service：Aoi+100% Electrical Test
SMT Efficiency：BGA.Qfp.Sop.Qfn.Plcc.Chip
OEM Turnkey high frequency Medical pcb circuit board manufacturer medical pcb assembly
Name：Medical device PCB assembly
Metal Coating：Silver,Copper,Gold,Tin
Mode of Production：SMT
Layers：Multilayer
Base Material：Fr4 Tg130,150,Tg170 /Aluminum
Certification：RoHS, ISO
Customized：Customized
Condition：New
Solder Mask Color：Black.Red.Yellow.White.Blue.Green
Testing Service：Aoi+100% Electrical Test
SMT Efficiency：BGA.Qfp.Sop.Qfn.Plcc.Chip
Industrial Control High Speed Data Acquisition PCB Assembly
Features
• 16-bit resolution
• 1 MS/s sample rate
• Up to 64 single-ended analog inputs
• Up to four 16-bit, 1 MS/s analog outputs
• 24 digital I/O lines
• Four 32-bit event counters
• Four timer outputs
• USB powered (no external power required)
• Includes USB cable and standoffs
• Small footprint for OEM and embedded applications Supported Operating Systems
Digital image acquisition and processing system PCB assembly
technical parameter
32 I/O inputs and 64 I/O outputs
2-way optical isolation RS232
1 RS422 interface and 1 RS485 interface
48-way 16-bit synchronous 200KSPS A/D conversion
One photoelectric isolation CAN interface and one GPS timing
Built-in real-time clock, power monitoring and watchdog, etc.
Support -40～85℃ industrial wide temperature application
Intelligent Industrial Communication PCB Assembly
technical indicators
1. Product-oriented regulations, mainly including: frequency converter, motor protection, actuator, low-voltage switch protection
2. Redundancy solution based on PROFIBUS slave redundancy profile
3. Unified version size 45MM×70MM
4. Unified user interface UART (1M bits/s), SPI (1MHZ)
5. Working temperature: -25～+60℃
6. Power supply: 3.3V/120mA + 5V/80mA, 2 groups of regulated voltage isolation
7. PROFIBUS-DP protocol:
8. DB9 socket, isolated 2KV, RS485 output;
9. Baud rate 9.6K～12M
Consumer Electronics OEM PCB Assembly Manufacturer
PCB Assembly Name：Industrial Control and Consumer Electronics OEM PCB Assembly Manufacturer
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing：X-ray, Aoi
Type：Rigid Circuit Board
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Transport Package：Packed in Carton
Specification：Copper
SMT Circuit Board PCBA Consumer Electronics Manufacturer
PCB Assembly Name：SMT Circuit Board Manufacturer for Consumer Electronics
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
MOQ：1 PCS
Layer：1-18 Layer
Copper Thickness：0.5oz-6oz
Board Thickness：0.2mm-4mm
Min.Hole Size：0.1mm (4 Mil)
Min.Line Spacing：0.1mm (4 Mil)
PCBA QC：X-ray, Aoi Test, Function Test(100% Test)
Specialised：Consumer, LED, Medical, Industrial, Control Board
Delivery：PCB, 7-10 Days;PCBA, 2-3weeks
Consumer Electronics Parts and PCBA Assembly SMT Service OEM
PCB Assembly Name：Consumer Electronics Parts and PCBA Assembly SMT Service OEM
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
MOQ：1 PCS
Layer：1-18 Layer
Copper Thickness：0.5oz-6oz
Board Thickness：0.2mm-4mm
Min.Hole Size：0.1mm (4 Mil)
Min.Line Spacing：0.1mm (4 Mil)
PCBA QC：X-ray, Aoi Test, Function Test(100% Test)
Specialised：Consumer, LED, Medical, Industrial, Control Board
Delivery：PCB, 7-10 Days;PCBA, 2-3weeks
Automotive central control screen display PCB assembly
PCB Assembly Name：Automotive central control screen display PCB assembly
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing：X-ray, Aoi
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Applicaton：Industrial PCB PCBA
Transport Package：Packed in Carton
Specification：Copper
Layer：1-18 Layer
Automotive Electronics Turnkey PCB Assembly
PCB Assembly Name：Automotive Electronics Turnkey PCB Assembly
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing：X-ray, Aoi
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Applicaton：Industrial PCB PCBA
Transport Package：Packed in Carton
Specification：Copper
Layer：1-18 Layer
Automotive Control Module PCB Assembly
PCB Assembly Name：Automotive Control Module PCB Assembly
Surface Finishing：HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing：X-ray, Aoi
Flame Retardant Properties：V0
Processing Technology：Electrolytic Foil
Insulation Materials：Organic Resin
Material：Complex
Applicaton：Industrial PCB PCBA
Transport Package：Packed in Carton
Specification：Copper
Layer：1-18 Layer
Energy Storage Module 150W Inverter PCB Assembly
Name：Energy Storage Module 150W Inverter PCB Assembly
Base Material：Copper
Insulation Materials：Epoxy Resin
Model：Energy Storage Module PCB Assembly
PCB Base：Fr-4
Voltage：DC12V
Color：Customized
Transport Package：Packed in Carton
Specification：RoHS, SGS, UL
Production Capacity：5000PCS/Month
Energy Storage Protection Circuit Module PCB Assembly
Name:Energy Storage Protection Circuit Module PCB Assembly
Specified Types：3-10s Li-ion/Li-Polymer/LiFePO4 Battery
L-Ion/Li-Polymer Charging Voltage：12.6V-42V
LiFePO4 Charging Voltage：10.8V-36V
Max. Continuous Charging Current：150A
Maximal Continuous Discharging Current：150A
Discharge Overcurrent Protection：400±50A(Adjustable)
Colour of PCM：Green
Balance：Yes
Transport Package：Antistatic Bag /White Box and Standard Export Cart
Specification：L230*W140*T35mm
12V to 220v energy storage module PCB Assembly
Name：12V to 220v energy storage module PCB Assembly
Metal Coating：Silver,Copper,Gold,Tin
Mode of Production：SMT
Layers：Multilayer
Base Material：Fr4 Tg130,150,Tg170 /Aluminum
Certification：RoHS, ISO
Customized：Customized
Condition：New
Solder Mask Color：Black、Red、Yellow、White、Blue、Green
Testing Service：Aoi+100% Electrical Test
SMT Efficiency：BGA.Qfp.Sop.Qfn.Plcc.Chip
Bidirectional inverter module PCB assembly
Name：Bidirectional inverter module PCB assembly
Efficiency: Maximum Efficiency: 94.5%
Function: with PFC function
Reliability: forward and reverse charging and discharging, high reliability
Standard: RoHS Compliant
Output voltage: high output voltage and current accuracy, better than 1%
Weight: Weight≤2.0kg
Size: 260mm×150mm×65mm
Application: outdoor portable power supply; single-phase inverter; UPS, industrial battery charge and discharge
Description: The 2.2kW high-power bidirectional inverter module INV2200-BD circuit realizes digital
Military Applications RF PCB Assembly
Name:Military Applications RF PCB Assembly
Surface processing:HASL/Plating gold / immersion gold /Plating gold finger/OSP/ Flux
Layers:1~32 layers
Copper Thickness:O.5OZ~5OZ
Board Thickness:0.2mm~6.0mm
Min Hole Size:0.2mm
Min Line Width:0.1mm
Min Line Spacing:0.1mm
Max board Size:508mm*609mm
Solder mask type:Green/ Black/ Red/ Yellow/ White/Blue
Silkscreen color:White / Yellow/ Black
